High-frequency electroplating equipment is a very expensive equipment, the classification method of high-frequency electroplating equipment is mainly from the Mercury Slip Ring principle to classify, from the electroplating principle, electroplating power must be dc power supply or pulse power supply. All kinds of plating tanks have different requirements for power supply, and the current and voltage of mercury slip ring should be controlled within a certain error range. Therefore, high frequency switching power supply is selected, with constant voltage, constant current, constant current density control functions, using IGBT module and unique driving protection mode.
Water electroplating process refers to the type of electroplating that requires rinsing of electroplated parts in the electroplating process. Electroplating power supply is a dc equipment that transforms the alternating current into different voltage, frequency and waveform. The "rectification" technology is mainly used in thyristor rectifier, and both "rectification" and "inverter" technology is used in high frequency switching power supply.
Water electroplating process refers to the type of electroplating that requires rinsing of electroplated parts in the electroplating process. Electroplating power supply is a dc equipment that transforms the alternating current into different voltage, frequency and waveform. The "rectification" technology is mainly used in thyristor rectifier, and both "rectification" and "inverter" technology is used in high frequency switching power supply.
In electroplating, the plated product is connected to the cathode and the metal to be plated to the anode. For example, nickel plating on copper plate is carried out in aqueous solution containing nickel sulfate. After electrification, the nickel on the anode gradually dissolved into positive ions, while the nickel continuously precipitated on the surface of the copper plate at the cathode. There are even other additives. 
The electrolyte is a solution containing the same ions as the anode metal. After electrification, the anode gradually dissolves into metal positive ions, and an equal number of metal ions in the solution obtain electrons on the cathode and then precipitate on the surface of the plated products, forming mercury slip ring metal coating. Copper sulfate is the source of copper ion (Cu2+), when dissolved in water will dissociate the copper ion, the copper ion will be reduced in the cathode (workpiece) (obtain electrons) to deposit metal copper. The deposition process is influenced by bath conditions such as copper ion concentration, pH, temperature, agitation, current, additives, etc.
In these high-frequency electroplating equipment, the role of mercury slip ring is very key, but as a part of the consumable material, the amount of mercury slip ring is also very large, so the quality requirements for mercury slip ring is very high. Senrip electronic mercury slip ring imported directly from Taiwan, its quality and quality are worth rest assured and rely on.
The above is the note about the use of mercury slip ring in high-frequency electroplating equipment. If you want to know more about our dynamic and products, please click to browse, we have slip ring, through bore slip ring, Ethernet Slip Ring, Slip Ring Connector, fiber slip ring, Conductive Slip Ring are on sale.
